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Module Power
模組效率
產品保固
Power Warranty
Designed for distributed applications with flexible deployment and stable performance.
TaiRay wafer and BC technology ensure enhanced reliability and reduced degradation.
High efficiency delivers superior energy yield and long-term power generation.
Optimized for cement rooftops and high-temperature operating environments.
| Cell Type | HPBC 2.0 |
| Cell Arrangement | 144 (6×24) |
| Junction Box | IP68 |
| 重量 | 32.3 kg |
| Module Dimensions | 2382 × 1134 × 30 mm |
| Packing Configuration | 36 pcs/carton, 720 pcs/40HQ |
